| 摘要 |
PROBLEM TO BE SOLVED: To provide a vertically holding structure of a vertical substrate, which vertically holds a vertical substrate to be arranged in the longitudinal direction with respect to a main substrate during the period of DIP and of eliminating the inclination of the vertical substrate. SOLUTION: In the vertically holding structure of a vertical substrate 2 inserted into a hole part 1a formed in a main substrate 1 and arranged in the longitudinal direction so as to prevent it from inclining during the period of DIP, solder 4 is heaped in the hole part 1a of the main substrate 1 on the front and back surfaces of the vertical substrate 2 and on a land 3 formed in a range extending in the vertical direction of the hole part 1a, and the solder 4 heaped on the vertical substrate 2 comes into contact with the inner surface of the hole part 1a of the main substrate 1 when the vertical substrate 2 is inserted into the hole part 1a of the main substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
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