发明名称 Connection structure between wired circuit boards
摘要 The connection structure between wired circuit boards connects a first wired circuit board and a second wired circuit board. The first wired circuit board includes a metal supporting layer, a first insulating layer formed on the metal supporting layer, and a first conductive pattern formed on the first insulating layer and having a first terminal portion. The metal supporting layer is arranged so as not to be opposed to the first terminal portion in a thickness direction. The first terminal portion and the first insulating layer opposed to the first terminal portion in a thickness direction are folded back into a curved shape. The second wired circuit board includes a second insulating layer, and a second conductive pattern formed on the second insulating layer and having a second terminal portion. The first terminal portion and the second terminal portion are electrically connected to each other.
申请公布号 US2009061660(A1) 申请公布日期 2009.03.05
申请号 US20080230037 申请日期 2008.08.22
申请人 NITTO DENKO CORPORATION 发明人 HONJO MITSURU
分类号 H05K1/00 主分类号 H05K1/00
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