Laser circuit etching by additive deposition

摘要

In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents a metal tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the structural integrity of the tape. The ablated metal becomes deposited to form circuit structures on a target structure.