发明名称 RADIO FREQUENCY MODULE ASSEMBLY
摘要 A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate.
申请公布号 US2009059539(A1) 申请公布日期 2009.03.05
申请号 US20080199682 申请日期 2008.08.27
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 RYU JONG GI;JANG IN JONG;WON KI HOON
分类号 H05K7/02;H01R12/14;H04N5/44 主分类号 H05K7/02
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