发明名称 |
RADIO FREQUENCY MODULE ASSEMBLY |
摘要 |
A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate.
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申请公布号 |
US2009059539(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080199682 |
申请日期 |
2008.08.27 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
RYU JONG GI;JANG IN JONG;WON KI HOON |
分类号 |
H05K7/02;H01R12/14;H04N5/44 |
主分类号 |
H05K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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