| 摘要 |
A heat dissipation device mounted on a heat-generating component of a graphics card, includes a base, a fin unit and a fan. The base is kept in intimate contact with the heat-generating component. The fin unit includes a plurality of fins arranged on the base and forming a plurality of air passages between each fin and its neighboring fins. The fan is mounted on the base, close to the fin unit and producing airflow in the air passages. The base comprises a spreader inlayed in the base. The spreader is a flattened heat pipe. A bottom surface of the spreader is in contact with the heat-generating component. The fin unit is thermally attached to a top surface of the spreader.
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