发明名称 |
LIGHT EMITTING DIODE PACKAGES |
摘要 |
Lighting packages are described for light emitting diode (LED) lighting solutions having a wide variety of applications which seek to balance criteria such as heat dissipation, brightness, and color uniformity. The present approach includes a backing of thermally conductive material and two or more arrays of LEDs attached to a printed circuit board (PCB). The PCB is attached to the top surface of the backing and the two or more arrays of LEDs are separated by a selected distance to balance heat dissipation and color uniformity of the LEDs. |
申请公布号 |
WO2007124276(A3) |
申请公布日期 |
2009.03.05 |
申请号 |
WO2007US66417 |
申请日期 |
2007.04.11 |
申请人 |
CREE, INC.;VILLARD, RUSSELL, G. |
发明人 |
VILLARD, RUSSELL, G. |
分类号 |
F21V21/00;F21K99/00 |
主分类号 |
F21V21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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