SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method forming a post at the semiconductor device assembling step. SOLUTION: A metallic mold 30 with a protrusion in a position corresponding to a connection terminal 14 is superposed on a lead frame material 20 and a sealing resin 12 is poured into the mold to seal with the resin. A metal paste 24 such as solder is poured into a hole 23 formed after removing the metallic mold 30 and the resin is cured at a fusing temperature of the metal paste 24 to form the post 17 on the connection terminal 14. COPYRIGHT: (C)2009,JPO&INPIT