INJECTION MOLDINGS, INJECTION-MOLDING APPARATUS AND METHOD THEREOF
摘要
<p>Disclosed are injection moldings, an injection-molding apparatus and a method thereof. The injection-molding apparatus comprises: a cavity mold having a cavity; a core mold having a core surface to form a molding space for injection moldings when being joined to the cavity mold; a heating unit for heating the cavity mold or the core mold; a cooling unit for cooling the cavity mold or the core mold; and a patterning stamp having a micrometer or nanometer sized pattern and provided on an inner surface of the molding space. According to the injection-molding apparatus, a micrometer or nanometer sized pattern is formed on a surface of injection moldings so as to have a super-hydrophobic characteristic and an optical characteristic, and a micrometer or nanometer sized pattern of a complex structure can be implemented.</p>
申请公布号
WO2009028745(A1)
申请公布日期
2009.03.05
申请号
WO2007KR04138
申请日期
2007.08.28
申请人
LG ELECTRONICS INC.;JUN, HYUN-WOO;KIM, YOUNG-BAE;JUNG, CHANG-IL;JEONG, SEOK-JAE;YOON, HYUNG-PYO