发明名称 |
SET FOR PREPARATION OF AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING |
摘要 |
<p>Disclosed is a set for preparation of an aqueous dispersion for chemical mechanical polishing, which comprises a first composition containing a colloidal silica and a basic compound and having a pH of not less than 8 but not more than 10, and a second composition containing a poly(meth)acrylate and a basic compound and having a pH of not less than 11 but not more than 13.5. The set for preparation of an aqueous dispersion may further comprise a third composition containing an oxidizing agent.</p> |
申请公布号 |
WO2009028256(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
WO2008JP61428 |
申请日期 |
2008.06.24 |
申请人 |
JSR CORPORATION;YANO, TSUYOSHI;SHIDA, HIROTAKA;UCHIKURA, KAZUHITO |
发明人 |
YANO, TSUYOSHI;SHIDA, HIROTAKA;UCHIKURA, KAZUHITO |
分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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