| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and a manufacturing method of a ceramic multilayered substrate capable of securing flatness of the ceramic multilayered substrate at low cost and by a simple process even if wiring electrodes are formed in the ceramic multilayered substrate. SOLUTION: This ceramic multilayered substrate 10 is provided with (a) a first insulation layer 13, (b) a second insulation layer 14 arranged in contact with the first insulation layer 13, and (c) wiring electrodes 16 embedded only in the second insulation layer 14. The first insulation layer 13 is formed by sintering a ceramic green sheet. The second insulation layer 14 is formed by sintering ceramic paste. Preferably, the thickness of the wiring electrode 16 is not smaller than half of the thickness of the second insulation layer 14. COPYRIGHT: (C)2009,JPO&INPIT |
