发明名称 |
NONVOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a nonvolatile memory device that can be highly integrated without the use of an SOI substrate and can minimize interference between adjacent cells through an optimized construction thereof, and to provide a manufacturing method therefor. SOLUTION: The nonvolatile memory device comprises: a semiconductor substrate having a body and a pair of fins projecting upward from the body; an embedded insulating layer which is embedded between the pair of fins; a pair of floating gate electrodes that are formed on each outer side of the pair of fins to be higher than the pair of fins; and control gate electrodes formed on the pair of floating gate electrodes. COPYRIGHT: (C)2009,JPO&INPIT
|
申请公布号 |
JP2009049403(A) |
申请公布日期 |
2009.03.05 |
申请号 |
JP20080200122 |
申请日期 |
2008.08.01 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KOO JUN-MO;KIM SUK-PIL;JIN YOUNG-GU;KIM WON-JOO;YOO IN-KYEONG;PARK YOON-DONG |
分类号 |
H01L21/8247;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|