| 摘要 |
PROBLEM TO BE SOLVED: To provide a stable room-temperature bonding apparatus which can prevent the surface of an electrode from oxidizing. SOLUTION: The bonding apparatus for bonding a plurality of electrode surfaces formed on two wafers, respectively, and includes: a flattening device 10 which flattens the electrode surfaces; an activating device 20 which activates the flattened electrode surfaces; an alignment device 30 which mutually positions the electrode surfaces; a superposing device 30 which puts the positioned electrode surfaces one over the other; a pressing device 40 which presses the two wafers put one over the other; and conveying devices 51, 52 and 53 which convey at least one wafer among the flattening device, activating device, alignment device, superposing device, and pressing device. COPYRIGHT: (C)2009,JPO&INPIT
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