| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a solder bump which prevents a harmful effect due to the internal stress of a barrier layer without complicating steps to improve the reliability of a juncture. SOLUTION: The method of forming the solder bump includes a step of forming a resist pattern 23 on a conductive layer 22 on a substrate 21, a step of forming a barrier layer 24 on the substrate 21 using the resist pattern 23 as a mask, a step of forming a solder layer 26 using the resist pattern 23 as a mask, and a step of removing the resist pattern 23 from the substrate 21. The barrier layer 24 is formed by the vacuum deposition method in an inert gas atmosphere. This lowers the density of the barrier layer 24 formed on the substrate 21. As a result, the internal stress of the barrier layer 24 is reduced, compared to a case of formation of the barrier layer 24 without the inert gas, to suppress delamination of the barrier layer 24 and contraction of the resist pattern 23 owing to the internal stress without increasing the number of steps. COPYRIGHT: (C)2009,JPO&INPIT
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