| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent normal temperature preservation characteristics, rapid curability and reflow resistance by using a curing accelerator prepared by forming a salt of DBU with a biphenylaralkyl type phenol resin. SOLUTION: The epoxy resin composition for sealing a semiconductor is characterized by comprising (A) an epoxy resin, (B) a phenol resin having≥2 phenolic hydroxy groups, (C) an inorganic filler and (D) the salt composed of the biphenylaralkyl type phenol resin having≥2 phenolic hydroxy groups forming an ion pair with the DBU as the curing accelerator. COPYRIGHT: (C)2009,JPO&INPIT
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