发明名称 |
APPARATUS AND METHOD FOR ELECTROCHEMICAL PROCESSING OF THIN FILMS ON RESISTIVE SUBSTRATES |
摘要 |
An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process. |
申请公布号 |
US2009057154(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080198274 |
申请日期 |
2008.08.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BASKER VEERARAGHAVAN S.;COTTE JOHN M.;DELIGIANNI HARIKLIA;FLOTTA MATTEO |
分类号 |
C25D7/12;C25D5/00;C25D17/10 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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