发明名称 APPARATUS AND METHOD FOR ELECTROCHEMICAL PROCESSING OF THIN FILMS ON RESISTIVE SUBSTRATES
摘要 An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.
申请公布号 US2009057154(A1) 申请公布日期 2009.03.05
申请号 US20080198274 申请日期 2008.08.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BASKER VEERARAGHAVAN S.;COTTE JOHN M.;DELIGIANNI HARIKLIA;FLOTTA MATTEO
分类号 C25D7/12;C25D5/00;C25D17/10 主分类号 C25D7/12
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