| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that can suppress a decrease in reliability and generation of mounting defects. SOLUTION: A chip element body 1 is formed first which is in a nearly rectangular parallelepiped shape and has end surfaces 11 and 12 and side surfaces 13 to 16 (a step S1 of forming the chip element body). A conductor green sheet 31 is formed (a step S2 of forming the conductor green sheet). Conductive paste 33 is applied to the end surfaces 11 and 12 of the chip element body 1 (a step S3 of coating the conductor paste). A chip element body is formed which has the conductor green sheet stuck on the end surface 11 of the chip element body 1 with the conductor paste 33 applied to the end surface 11 (a step S4 of sticking the conductor sheet). In the step S4, the end surface of the conductor green sheet 31 on sides of the side surfaces 13 to 16 is positioned more outside than the side surfaces 13 to 16, and the conductor paste 33 applied to the end surface 11 is extruded to between the conductor green sheet 31 and ridge portions R13 to R16. COPYRIGHT: (C)2009,JPO&INPIT
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