| 摘要 |
A solderable structure is described, wherein the structure comprises at least one wafer, a stack of a plurality of electrically conductive layers, wherein one lowermost electrically conductive layer out of the plurality of electrically conductive layers is arranged on the wafer, and at least one solder ball, wherein the at least one solder ball is arranged on an uppermost layer of the plurality of electrically conductive layers, wherein the solder ball comprises Sn, Ag and Cu, and wherein the Cu content of the solder ball lies between 0,5 and 3 weight percent.. Furthermore a method for producing a solderable structure is described, wherein the method comprises the steps of arranging a stack of a plurality of electrically conductive layers on a wafer and arranging a solder ball on an uppermost layer of the plurality of electrically conductive layers, wherein the solder ball has a Cu content between 0,5 and 3 weight percent. |
