| 摘要 |
A flip chip type semiconductor package is provided to maintain electric connection between a solder ball and connection pad good by relieving stress of the semiconductor. A flip chip semiconductor package comprises a substrate(10), a semiconductor chip(20), and stress adsorption member(30). A substrate has connection pads and the semiconductor chip has the bonding pad s and the solder bump. The bonding pad and solder bumps electrically are connected with each other. The stress adsorption member is arranged between the substrate and the semiconductor chip. The stress adsorption member has the stress adsorption body(32), a conduction ball(34), and a mobility resin. A mobility resin is positioned within openings in order to correspond to the stress of the semiconductor chip.
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