摘要 |
<p>Aldehyde compounds (I) are new. Aldehyde compounds of formula (O=CH-C(R 1>)(R 2>)-CH(R 3>)-N(R 4>)(R 5>)) (I) are new. Either R 1>, R 2>an univalent 1-12C-hydrocarbon; or R 1>R 2>a bivalent 4-12C hydrocarbon (whose one part is optionally substituted by carboxylic ring with 5-8, preferably 6C); R 3>H or 1-12C-alkyl, -aryl alkyl or -alkoxycarbonyl; and either R 4>, R 5>CH 3or an univalent 2-20C-aliphatic, -cycloaliphatic or -aryl aliphatic residue, which optionally contains OH or CHO group, and heteroatom in the form of ether oxygen or tertiary amine nitrogen, when R 4>contains at least one OH; or R 4>R 5>a bivalent 4-12C-aliphatic residue containing at least one OH (whose one part is optionally substituted by heterocyclic rings with 5-8, preferably 6 ring atoms, where the ring optionally contains heteroatom in the form of ether-oxygen or tertiary amine-nitrogen, and CHO group). Independent claims are included for: (1) an aldehyde compound of formula (O=CH-C(R 1>)(R 2>)-CH(R 3>)-N +>(R 4>)(R 5>)(R 9>)) (VII) obtained by protonating or alkylating (I); (2) the preparations of (I); (3) a polyol containing at least an aldehyde group, which is obtained by the polyalkoxylation of (I); (4) a hardenable composition comprising at least a polyisocyanate and (I) or (VII); (5) a hardened composition obtained by the reaction of the hardenable composition and water, preferably in the form of moisture; (6) a process for adhering a substrate S1 with a substrate S2 comprising applying the hardenable composition on the substrate S1 and contacting the applied composition with the substrate S2 within the open time of the composition, or applying the hardenable composition on the substrate S1 and substrate S2 and contacting the applied composition together within the open time of the composition, where the substrate S2 consists of same or different material of the substrate S1; (7) a process for sealing the substrates S1 and S2 comprising applying the hardenable composition between the substrate S1 and the substrate S2, so that the composition contacts with the substrate S1 and the substrate S2; and (8) a process for coating the substrate S1 comprising applying the hardenable composition on the substrate S1 within the open time of the composition. R 9>H, 1-20C-alkyl, cycloalkyl or aryl alkyl.</p> |