APPRATUS FOR DIPPING SOLID ELECTROLYTIC CONDENSER AND METHOD FOR DIPPING SOLID ELECTROLYTIC CONDENSER

摘要

An apparatus for dipping solid electrolytic condenser and a method thereof are provided to improve reliability of a condenser by forming uniform dipping thickness on a surface of a condenser device regardless of a structure of the condenser device and viscosity of a dipping liquid. An apparatus for dipping solid electrolytic condenser comprises a dipping tray(130) and a vibrating unit. The dipping tray stores a dipping liquid(2) for dipping a condenser device(3). The vibrating unit vibrates the dipping tray, and includes a vibrating plate and a vibrating device. The vibrating plate is installed in a bottom of the dipping tray. The vibrating device vibrates the vibrating plate, and a cam. The cam is installed in a bottom of the vibrating plate, converts a rotary motion into back and forth motion, and delivers the back and forth motion to the vibrating plate. The dipping tray is detachably assembled in a top of the vibrating plate.