ELECTRIC CONNECTOR OF MOLDED INTERCONNECTION DEVICE AND METHOD FOR FABRICATING THE SAME
摘要
A wiring of MID(Molded Interconnection Device) and a manufacturing method thereof are provided to reduce thickness of an electronic device by excluding an additional contact member. A MID wiring(120) is formed on a surface of a molded case(110) having electric insulated property. The molded case is formed by an injection-molding of thermoplastic resin. A first electronic part is loaded inside the molded case. A second electronic part is mounted on a surface of the molded case. The MID wiring contacts the first electronic part with the second electronic part. The MID wiring is protruded in a contact point of the first electronic part and the second electronic part, and is made of soft conductive material. The soft conductive material includes a conductive rubber.
申请公布号
KR20090021783(A)
申请公布日期
2009.03.04
申请号
KR20070086604
申请日期
2007.08.28
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, SE HO;LEE, YOUNG MIN;KIM, KI HYUN;KANG, SEOK MYONG