| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate, along with a semiconductor device using it, wherein a sufficient bonding space is assured for a band-like bond pad pattern on a substrate and, even if the mounting position of a semiconductor chip is displaced, contacting between adjoining wires is prevented. <P>SOLUTION: In at least one line of a band-like bond pad pattern 12, the band-like bond pad pattern 12 formed around four corners of a semiconductor chip 801 is arranged close to the end of a wiring substrate 101, relative to the band-like bond pad pattern 12 at other portion, so that the interval between wires 15a and 15b is assured while reduction of wiring and via arrangement region 17 is suppressed to a minimum. <P>COPYRIGHT: (C)2009,JPO&INPIT |
