| 摘要 |
PROBLEM TO BE SOLVED: To uniformly, efficiently and surely clean the entire surface to be cleaned of a substrate to be treated within the prescribed time when cleaning the substrate. SOLUTION: The substrate cleaning apparatus comprises a spin chuck 20 for rotatably holding a wafer W, a two-fluid nozzle 10 for supplying cleaning liquid to the surface of the wafer W held by the spin chuck 20, and a moving mechanism 30 connected to the two-fluid nozzle 10 for moving the two-fluid nozzle 10 along the surface of the wafer W held by a rotary holding part 20. A control part 50 for controlling the moving mechanism 30 so as to lower the moving speed v<SB>k</SB>of the two-fluid nozzle 10 stepwise in n stages when moving the two-fluid nozzle 10 from the center part of the wafer W to the peripheral edge part of the wafer W by the moving mechanism 30 is connected to the moving mechanism 30. The control part 10 makes the moving speed v<SB>1</SB>of the two-fluid nozzle 10 in the first stage of cleaning the center part of the wafer W slower than the ideal moving speed v<SB>d1</SB>of the two-fluid nozzle 10 in the first stage. COPYRIGHT: (C)2009,JPO&INPIT
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