METHOD FOR CUTTING MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, AND BACKLIGHT DEVICE

摘要

In order to cut off, without causing any burr, a multilayer substrate having a metal layer on a front surface and a second metal layer on a back surface, a method for cutting the multilayer substrate is a method for cutting the multilayer substrate having a metal layer on the front surface and a backside electrode on the back surface, the method including the step of cutting the multilayer substrate into certain depth respectively from a metal layer side and from a backside electrode side, width of a notch on the metal layer side and width of a notch on the backside electrode side being different from each other.