发明名称 Method of Manufacturing Nitride Substrate for Semiconductors
摘要 In an independent GaN film manufactured by creating a GaN layer on a base heterosubstrate using vapor-phase deposition and then removing the base substrate, owing to layer-base discrepancy in thermal expansion coefficient and lattice constant, bow will be a large ±40 mum to ±100 mum. Since with that bow device fabrication by photolithography is challenging, reducing the bow to +30 mum to -20 mum is the goal. The surface deflected concavely is ground to impart to it a damaged layer that has a stretching effect, making the surface become convex. The damaged layer on the surface having become convex is removed by etching, which curtails the bow. Alternatively, the convex surface on the side opposite the surface having become convex is ground to generate a damaged layer. With the concave surface having become convex due to the damaged layer, suitably etching off the damaged layer curtails the bow.
申请公布号 US2009029550(A1) 申请公布日期 2009.01.29
申请号 US20080238449 申请日期 2008.09.26
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 MATSUMOTO NAOKI
分类号 H01L21/302;H01L21/3065;C30B29/40;C30B33/00;H01L21/20;H01L21/205;H01L21/304;H01L21/306 主分类号 H01L21/302
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