ALIGNMENT PRECISION ENHANCEMENT OF ELECTRONIC COMPONENT PROCESS ON FLEXIBLE SUBSTRATE DEVICE AND METHOD THEREOF THE SAME

摘要

Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.