High performance semiconductor module with connected substrate carrier and corresponding production method

摘要

The power semiconductor module has housing (10), an extension (20), a substrate carrier (40), a circuit configuration (50) and outgoing electrical connection elements (60). The substrate carrier has a continuous recess (42), which extends from the inner main surface (44) opposite the inside of power semiconductor module to its outer main surface (46). An independent claim is also included for method for a manufacturing a power semiconductor module.