| 摘要 |
A method for forming metal wire including interlayer insulation layer, via hole, trench, plug, and barrier film is provided to prevent oxidation of conductive metal plug by forming barrier film on top of conductive metal plug. An interlayer insulation film(100) is formed on a wafer. A via hole and a trench are formed by selectively patterning the interlayer insulation film. A plug(130) is formed by coating a conductive metal inside the via hole. A barrier film(140) is formed in bottom of the trench including the plug. A metal wire is formed inside the trench by plating the wafer.
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