| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide TSV (Through Silicon Via) chip stack package in which a chip is easily selected even during element operation. <P>SOLUTION: The through silicon via chip stack package includes a substrate: many chips stacked over the substrate and provided with chip selection pads, through silicon vias and rewirings connecting the chip selection pad and the through silicon via respectively, the through silicon via being connected to one another; and outside connection terminals attached to a lower surface of the substrate, wherein the rewirings in each of stacked chips are formed so as to have connection structures between the chip selection pads and the through silicon vias which are different from one another in each of the chips. <P>COPYRIGHT: (C)2009,JPO&INPIT |
