| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mount quartz device preventing cracks from occurring in solder because of a difference in a thermal expansion coefficient to a set substrate. SOLUTION: In a quartz device, at least a pair of mounted electrodes 5, which is provided on the outer bottom surface of a vessel body 1 that stores a crystal piece and is made of ceramic and has Ni and Au films successively provided on a ground electrode, is connected to a circuit terminal 8 provided on the surface of the set substrate 7 made of glass epoxy with solder 9. In this case, the vessel body 1 is made of ceramic by low-temperature burning, and the ground electrode of the mounted electrode 5 is made of Cu. COPYRIGHT: (C)2009,JPO&INPIT
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