发明名称 SUBSTRATE MANUFACTURING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To make a hole position of a mask for regulating the position of a conductive ball coincide with a pad position of a substrate. SOLUTION: This substrate manufacturing apparatus 100 has a substrate delivery path 120 through which a multi-unit substrate 110 is delivered and a mask delivery path 140 through which an individual mask 130 is delivered. The substrate delivery path 120 has a pad detecting device 160 for detecting a position of a pad formed on a surface of the substrate 110. The mask delivery path 140 has a mask hole detecting device 220 for detecting a position of a conductive ball inserting hole of the individual mask 130. A moving position of an adsorbing head 212 is adjusted in such a manner that the position of the conductive ball inserting hole is coincident with that of the pad of the substrate 110 based on pad position information of the pad detecting device 160 and mask hole position information of the mask hole detecting device 220. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009004724(A) 申请公布日期 2009.01.08
申请号 JP20070229424 申请日期 2007.09.04
申请人 SHINKO ELECTRIC IND CO LTD 发明人 IIDA KIYOAKI;TANAKA KAZUO;SAKAGUCHI HIDEAKI;AZUMA MITSUTOSHI
分类号 H05K3/34;B23K3/06;H01L23/12;H05K3/00 主分类号 H05K3/34
代理机构 代理人
主权项
地址