| 摘要 |
PROBLEM TO BE SOLVED: To prevent a harmful influence to a substrate in terms of a process by using a pressure reduction means according to a situation. SOLUTION: A control section 77 operates an exhaust mechanism 71 to allow a vacuum pump 69 to perform exhaust speedily and slowly in first and second treatments, respectively. In the first treatment, the substrate W is dipped into a treatment liquid in a treatment tank 1, thus preventing the substrate W from being adversely affected in terms of the process even if pressure is reduced quickly. In the second treatment, since the substrate W is pulled out of the treatment liquid and is exposed in a chamber 27, the substrate W may be affected adversely in terms of the process because of rapid pressure decrease. Therefore, in the second treatment, pressure is reduced gradually by low-speed exhaust, thus preventing a harmful influence to the substrate W in terms of the process by suppressing a rapid decrease in pressure. COPYRIGHT: (C)2009,JPO&INPIT
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