METHOD FOR MANUFACTURING METAL WIRING SUBSTRATE AND METAL WIRING SUBSTRATE FORMED BY USING IT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal wiring substrate by which transformation of a metal precursor coat formed by applying metallic microparticle-dispersed liquid to a substrate into a metal coat and productivity when making metal wiring substrates is improved and to provide a metal wiring substrate which is formed by using it. SOLUTION: The method for manufacturing the metal wiring substrate includes a first step (S11) by which the metal microparticle-dispersed liquid formed by dispersing metal microparticles in a solvent is applied to the surface of the substrate for forming the metal precursor coat, a step (S12) by which the metal precursor coat is heat-treated, a step (S13) by which the surface of the metal precursor coat is irradiated with energy beams by scanning for metalizing the metal precursor coat in the area irradiated with the energy beams and a step (S14) by which the metal precursor coat in the region not irradiated with the energy beams is eliminated. COPYRIGHT: (C)2009,JPO&INPIT