发明名称 |
SEMICONDUCTOR MEMORY AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor memory which can be formed efficiently and which employs SOI technique. SOLUTION: The semiconductor memory includes a silicon substrate 1. The silicon substrate has a first region which has an embedded insulating layer below a single-crystal silicon layer and a second region which is adjacent to the first region and does not have the embedded insulating layer below the single silicon layer. A memory cell transistor 14a has a first gate electrode, which is provided on the single-crystal silicon layer in the first region. A selection gate transistor 14b has a second gate electrode, which is provided adjacently to the memory cell transistor and partially disposed on the single-crystal silicon layer in the second region. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009004638(A) |
申请公布日期 |
2009.01.08 |
申请号 |
JP20070165365 |
申请日期 |
2007.06.22 |
申请人 |
TOSHIBA CORP |
发明人 |
WATANABE SHINICHI;ARAI FUMITAKA;MIZUKAMI MAKOTO;KONDO MASAKI;INOUE HIROFUMI |
分类号 |
H01L21/8247;H01L21/762;H01L27/10;H01L27/115;H01L27/12;H01L29/786;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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