| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembly which can compensates better not desirable impact due to strong flexure even if temperature changes, as a probe card assembly which fixes a printed circuit board. SOLUTION: The probe card assembly includes a stiffener 1, a printed circuit board 2 disposed in the stiffener 1, and a spider supported by the stiffener 1 and the printed circuit board 2 and including at least one probe to test a wafer 5. The probe card assembly of the printed circuit board 2 is supported in a loosely decoupled manner in the stiffener 1 to prevent transmission of high thermally-induced warping effects. COPYRIGHT: (C)2009,JPO&INPIT |
