Apparatus and method for plating semiconductor wafers,申请号EP20050253610-传众专利搜索

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发明名称	Apparatus and method for plating semiconductor wafers
摘要
申请公布号	EP1619275(A3)	申请公布日期	2008.12.24
申请号	EP20050253610	申请日期	2005.06.11
申请人	LAM RESEARCH CORPORATION	发明人	DORDI, YEZDI N.;REDEKER, FRED C.;BOYD, JOHN M.;MARASCHIN, ROBERT;WOODS, CARL
分类号	C25D5/06;C25D7/12	主分类号	C25D5/06
代理机构		代理人
主权项
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