METAL PLUGGED SUBSTRATES WITH NO ADHESIVE BETWEEN METAL AND POLYIMIDE

摘要

In a method and apparatus for fabricating a semiconductor device (100) having a flexible tape substrate (110), a hole is punched in the flexible tape substrate. The flexible tape substrate includes a metal layer (120) attached to a polyimide layer (130) without an adhesive therebetween. A cover is placed on the metal layer to cap a base of the hole (140). A metal is deposited on the cover (150) exposed at the base of the hole, the metal being used to form a bond with the metal layer. The metal being deposited causes the hole to be plugged up to a selective height. Upon removal of the cover, the metal may also be deposited on the metal layer to increase a thickness of the metal layer.