发明名称 BONDING METHOD, BONDED BODY, LIQUID JETTING HEAD AND LIQUID JETTING DEVICE
摘要 A bonding method is provided with a step of forming plasma-polymerized films on the surfaces of the two base materials, respectively; a step of activating each surface by selectively applying ultraviolet to a prescribed region of a part of the surface of each plasma-polymerized film; and a step of obtaining a bonded body by bonding the two base materials to have the activated regions on the surfaces of the plasma-polymerized films adhere to each other and by partially bonding the two base materials at the portion where the ultraviolet applied region of one plasma-polymerized film overlaps with the ultraviolet applied region of the other plasma-polymerized film.
申请公布号 WO2008156055(A1) 申请公布日期 2008.12.24
申请号 WO2008JP60983 申请日期 2008.06.16
申请人 SEIKO EPSON CORPORATION;MATSUO, YASUHIDE 发明人 MATSUO, YASUHIDE
分类号 B29C65/02;B32B27/00;B32B27/16;B41J2/045;B41J2/055;B41J2/16 主分类号 B29C65/02
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