CIRCUIT MATERIALS, MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF

摘要

A circuit assembly (110) comprises two or more circuit laminates (112, 118), each comprising a conductive metal layer (116, 122, 124) disposed on a poly(arylene ether ketone) substrate layer, wherein at least one of the conductive metal layers has been patterned to form a circuit, and a bond ply layer (126) comprising a thermoplastic or thermosetting material. The thermoplastic bond ply has a melting point between 250°C and 37O°C, a decomposition temperature greater than about 290°C and a dissipation factor of less than 0.01 at 10 GHz. The thermoset bond ply has a dissipation factor les than 0.01 at 10 GHz and a decomposition temperature greater than about 2900C after lamination. Methods of forming the above circuit assemblies are also disclosed.