CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

摘要

A circuit board (1) whereupon a semiconductor chip is to be flip-chip mounted is provided with an electrode pad (3) formed on the surface of a board main body (2), and a solder resist layer (4) which covers the surface of the board main body (2) and has an opening section (4a) for exposing the electrode pad (3). The solder resist layer (4) is formed not to be in contact with the electrode pad (3) and to have a value H/L satisfy the inequalities of 1.0=H/L=1.5, where, L is the maximum width of the electrode pad and H is the thickness of the solder resist layer.