发明名称 |
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, KIT FOR CHEMICAL MECHANICAL POLISHING, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING |
摘要 |
<p>A chemical mechanical polishing aqueous dispersion comprises (A) abrasive grains, (B) at least one of quinolinecarboxylic acid and pyridinecarboxylic acid, (C) an organic acid other than quinolinecarboxylic acid and pyridinecarboxylic acid, (D) an oxidizing agent, and (E) a nonionic surfactant having a triple bond, the mass ratio (WB/WC) of the amount (WB) of the component (B) to the amount (WC) of the component (C) being 0.01 or more and less than 2, and the component (E) being shown by the following general formula (1),
wherein m and n individually represent integers equal to or larger than one, provided that m+n‰¤50 is satisfied.</p> |
申请公布号 |
EP2006890(A2) |
申请公布日期 |
2008.12.24 |
申请号 |
EP20070739933 |
申请日期 |
2007.03.27 |
申请人 |
JSR CORPORATION;KABUSHIKI KAISHA TOSHIBA |
发明人 |
UCHIKURA, KAZUHITO;SHIDA, HIROTAKA;HASHIGUCHI, YUUICHI;MINAMIHABA, GAKU;FUKUSHIMA, DAI;TATEYAMA, YOSHIKUNI;YANO, HIROYUKI |
分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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