发明名称 OBSERVING DEVICE AND METHOD
摘要 <p>While observing a semiconductor device (11), when it is detected that a solid-immersed lens (6) touches the semiconductor device (11), a vibration generating section vibrates the solid-immersed lens (6). A reflection light image from the solid-immersed lens (6) is inputted. The amount of reflection light m of the reflection light image is computed. It is judged whether or not the ratio (m/n) of the amount of reflection light m to the amount of incident light n is over a threshold A. If the ratio (m/n) is over the threshold A, it is judged that the optical contact between the solid-immersed lens (6) and the semiconductor device (11) is not established, and the solid-immersed lens (6) is vibrated again. If the ratio (m/n) is not over the threshold A, it is judged that the optical contact between the solid-immersed lens (6) and the semiconductor device (11) is established, and an observation image of the semiconductor device (11) is acquired. With this, an observation device and method enabling improvement of adhesion between the solid-immersed lens and the observation subject is realized.</p>
申请公布号 WO2008156038(A1) 申请公布日期 2008.12.24
申请号 WO2008JP60893 申请日期 2008.06.13
申请人 HAMAMATSU PHOTONICS K.K.;TERADA, HIROTOSHI;TANABE, HIROSHI 发明人 TERADA, HIROTOSHI;TANABE, HIROSHI
分类号 G02B21/00 主分类号 G02B21/00
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