PARTICLE REMOVAL UNIT OF WAFER BACK-SIDE AND SEMICONDUCTOR SPIN COATER HAVING THE SAME

摘要

A unit for removing foreign materials in the back side of a wafer and a semiconductor spin coater having the same are provided to facilitate removing foreign materials of peripheral units including a rear side and top surface of a wafer so that the contamination of a photoresist layer coated onto the top surface of the wafer is prevented. A unit(200) for removing foreign materials in the back side of a wafer comprises a unit body(210), and a gas jet part(220). The unit body is arranged in the bottom of the wafer. The gas jet part is prepared in the unit body. The gas jet part forms a gaseous film of a constant radius in order to be connected to the back side of the wafer.