An electroplating method is provided to form bright and uniform plating layer deposited on the metal of a cathode by removing the oxide formed on the metal surface of an anode. An electroplating method comprises a step of cleaning the metal surface of an anode by using sound energy(S10), a step of eluting the metallic ion at the anode(S20), and a step of forming a plating layer by depositing the eluted metallic ion on the metal of a cathode(S30). The cleaning step includes a step of dipping the metal of the anode in a cleaning solution(S12), and a step of irradiating one selected from the group consisting of sound wave, and ultrasonic wave and hypersonic wave to the metal of the anode in the cleaning solution(S14).
申请公布号
KR20080111932(A)
申请公布日期
2008.12.24
申请号
KR20070060499
申请日期
2007.06.20
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
PARK, JONG WON;KIM, YOUNG HA;CHUNG, WON SUB;SHIN, HEON CHEOL;JOUNG, DA HEE;HWANG, YUN SEOK;YANG, DEK GIN