| 摘要 |
PROBLEM TO BE SOLVED: To convey a wafer which is pasted on a supporter after thinning and singulating. SOLUTION: Half dicing is executed on the surface of a wafer to form grooves 4, and a rigid supporter 5 is pasted on the surface of the wafer via an adhesive layer 6. Then, the rear surface of the wafer is cut and singulated into chips 2b, and rear surface processing such as formation of rear electrodes 9a followed by heat treatment is executed without separating the chips 2b from the supporter 5. COPYRIGHT: (C)2008,JPO&INPIT |
