发明名称 |
SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME |
摘要 |
A semiconductor package and a method of fabricating the same. The method includes providing a semiconductor substrate on which a chip pad is formed. A wire redistribution layer connected to the chip pad is formed. An insulating layer which includes an opening exposing a portion of the wire redistribution layer is formed. A metal ink is applied within the opening to thereby form a bonding pad. The applied metal ink within the opening and the insulating layer can be cured simultaneously.
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申请公布号 |
US2008230877(A1) |
申请公布日期 |
2008.09.25 |
申请号 |
US20080050343 |
申请日期 |
2008.03.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHUNG HYUN-SOO;JANG DONG-HYEON;HWANG SON-KWAN;KIM NAM-SEOG |
分类号 |
H01L23/495;H01L21/768 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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