| 摘要 |
<p>A plastic substrate (10) is laser-cut, while emitting a laser beam, by moving a laser emitting unit (12) arranged to confront the plastic substrate (10), relatively along the surface of the plastic substrate (10). At this time, a shielding member (15) is arranged outside of the laser-irradiated region in the plastic substrate (10). Moreover, the plastic substrate (10) is made to contact a liquid (32) on its side opposed to the laser-irradiated side.</p> |
