| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heater plate and a package heating apparatus for improving a yield at a low cost without deteriorating the productive efficiency of a semiconductor and the adhesion of the wire bonding. <P>SOLUTION: The heater plate 1 and a heater 13 are mounted to an elevating mechanism 10, and are raised by a fixed stroke toward the bottom face of the package 12 each time the carrier 8 stops at a predetermined position. At that time, an island stage 5 pushes the bottom face of the package 12 stopped at the bonding preparing position located directly under the bonding treatment position up to the bonding treatment position while supporting it by the top face thereof. At the same time, as first and second pre-heat stages 3 and 4 are lower than the island stage 5, they mildly heat the package 12 respectively in the state wherein clearances are formed between the bottom face of the package 12 stopped on the upstream side of the bonding preparing position and their top faces respectively, so that no crack is produced in the package 12. <P>COPYRIGHT: (C)2008,JPO&INPIT |
