| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem of a conventional semiconductor device that the sealing resin filled in the region between a substrate and a semiconductor chip increases the parasitic capacitance of the region. <P>SOLUTION: The semiconductor device includes a substrate 2, a semiconductor chip 1 which is flip-chip mounted on the substrate 2, and a semiconductor chip 6 provided on the semiconductor chip 1. A space 5 exists between the substrate 2 and the semiconductor chip 1. <P>COPYRIGHT: (C)2008,JPO&INPIT |
