| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a cover and a transparent member for protecting a semiconductor element can be stably fixed and the entire size thereof can be reduced. <P>SOLUTION: The semiconductor element 10 is mounted on a board part 60 of a package 50 having a rectangular board part 60 and ribs 70, 70 provided on a pair of opposed outer edges of the board part 60, and electrode pads 20 of the semiconductor element 10 are connected to connection electrodes 75 provided on the top faces 70b of the ribs by thin metallic wires 22. Spacers 80, 80 are provided on the top faces 70b of the ribs outside the connection electrodes 75, and a transparent cover 90 covering the entire surface of the package 50 is attached to the top faces of the spacers 80, 80. The height of the spacers 80, 80 is larger than the diameter of the thin metallic wire 22. <P>COPYRIGHT: (C)2008,JPO&INPIT |
